cystech electronics corp. spec. no. : c339sf issued date : 2003.06.16 revised date :2007.08.24 page no. : 1/3 csfr10xsf cystek product specification 1.0amp. surface mount ul tra fast recovery diodes csfr10xsf series features ? for surface mounted applications. ? plastic material used carries underwriters laboratory flammability classification 94v-0 ? low leakage current ? high surge capability ? high temperature soldering: 250 c/10 seconds at terminals ? exceeds environmental standards of mil-s-19500/228 mechanical data ? case: molded plastic, jedec sod-123/mini sma. ? terminals: solder plated, solderable per mil-std-750 method 2026 ? polarity: indicated by cathode band. ? packaging: 12mm tape per eia std rs-481. ? weight: 0.04 gram maximum ratings and electrical characteristics ( rating at 25 c ambient temperature unless otherwise specified. ) type parameter symbol csfr 101 csfr 102 csfr 103 csfr 104 csfr 105 csfr 106 csfr 107 units repetitive peak reverse voltage v rrm 50 100 200 300 400 600 800 v maximum rms voltage v rms 35 70 140 210 280 420 560 v maximum dc blocking voltage v r 50 100 200 300 400 600 800 v maximum instantaneous forward voltage, i f =1a (note 1) v f 1 1 1 1.3 1.3 1.7 1.7 v reverse recovery time trr 50 50 50 50 50 75 75 ns average forward rectified current @t a =50 i o 1 a peak forward surge current @8.3ms single half sine wave superimposed on rated load (jedec method) i fsm 30 a maximum dc reverse current v r =v rrm ,t a =25 (note 1) v r =v rrm ,t a =125 (note 1) i r 5 150 a a maximum thermal resistance, junction to ambient r th,ja 42 (typ) /w diode junction capacitance (note 2) c j 20 (typ) pf storage temperature tstg -55 ~ +150 operating temperature t j -55 ~ +150 notes : 1. pulse test, pulse width=300 sec, 2% duty cycle 2 . f=1mhz and applied 4.0v dc reverse voltage.
cystech electronics corp. spec. no. : c339sf issued date : 2003.06.16 revised date :2007.08.24 page no. : 2/3 csfr10xsf cystek product specification characteristic curves forward current derating curve 0 0.2 0.4 0.6 0.8 1 1.2 0 25 50 75 100 125 150 175 ambient temperature---ta() average forward current---io(a) single phase half wave 60hz, resistive or inductive load maximum non-repetitive forward surge current 0 5 10 15 20 25 30 35 11 0 number of cycles at 60hz peak forward surge current---ifsm(a 1 0 0 ) tj=25, 8.3ms single half sine wave jedec method forward current vs forward voltage 0.001 0.01 0.1 1 10 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 forward voltage---vf(v) forward current---if(a) tj=25, pulse width=300s, 1% duty cycle csod101-103 csfr104-105 csfr106-107 junction capacitance vs reverse voltage 0 10 20 30 40 50 60 0.01 0.1 1 10 100 reverse voltage---vr(v) junction capacitance---cj(pf)
cystech electronics corp. spec. no. : c339sf issued date : 2003.06.16 revised date :2007.08.24 page no. : 3/3 csfr10xsf cystek product specification sod-123 dimension marking code: device csfr 101 csfr 102 csfr 103 csfr 104 code h1 h2 h3 h4 device csfr 105 csfr 106 csfr 107 code h5 h6 h7 sod-123 plastic surface mounted package cystek package code: sf *:typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.138 0.154 3.5 3.9 e 0.051 0.067 1.3 1.7 b 0.055 0.071 1.4 1.8 f 0.035(typ) 0.9(typ) c 0.012(typ) 0.3(typ) g 0.035(typ) 0.9(typ) d 0.110 0.126 2.8 3.2 - - - - - notes : 1.controlling dimension : millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material : ? lead : 42 alloy ; solder plating ? mold compound : epoxy resin family, flammability solid burning class:ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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